Brief Introduction Applications of Aluminum Nitride Ceramics

20-09-2019
About Aluminum Nitride Ceramics

Aluminum Nitride (AlN) Ceramic is an excellent material to use if high thermal conductivity and electrical insulation properties are required; making it an ideal material for use in thermal management and electrical applications.

Additionally, Aluminum Nitride Ceramic is common alternative to Beryllium Oxide (BeO) in the semiconductor industry as it is not a health hazard when machined.

Aluminum Nitride Ceramic has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon Wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.

Brief Introduction Applications of Aluminum Nitride Ceramics


Properties of Aluminum Nitride Ceramics
  • High thermal conductivity

  • Low coefficient of thermal expansion

  • Good electrical insulation and resistivity

  • Low dielectric constant

  • High mechanical strength under compression load

  • Corrosion resistant (gas)

  • Good thermal shock resistance


Applications of Aluminum Nitride Ceramics

  • Heat sinks & heat spreaders

  • Electrical insulators for lasers

  • Chucks, clamp rings for semiconductor processing equipment

  • Electrical insulators

  • Silicon wafer handling and processing

  • Substrates & insulators for microelectronic devices & opto electronic devices

  • Substrates for electronic packages

  • Chip carriers for sensors and detectors

  • Chiplets

  • Collets

  • Laser heat management components

  • Molten metal fixtures

  • Packages for microwave devices


Brief Introduction Applications of Aluminum Nitride Ceramics

Properties
Units
Value
Color

Grey
Mechanical Properties


Density
g/cm3
3.31
Modulus of Elasticity
GPa
310
Fracture toughness
Mpa x m^1/2
3.5
Poissons Ratio

0.25
Compressive Strength
MPa
2100
Flexural Strength
MPa
335
Hardness (Knoop 100 g)
Kg/mm2
1170
Hardness (Vickers)
GPa
11
Thermal Properties


Maximum Temperature *


Oxidizing
°C
700
Inert
°C
1300
Thermal Conductivity


@ 25°C
W/mK
180
@ 300°C
W/mK
130
Specific Heat
J/kg.K
750
Thermal Shock Resistance ΔT
°C
400
Coefficient of Expansion


CTE 25°C ➞ 100°C
10^-6/°C
3.6
CTE 25°C ➞ 300°C
10^-6/°C
4.6
CTE 25°C ➞ 500°C
10^-6/°C
5.2
CTE 25°C ➞ 1000°C
10^-6/°C
5.6
Electrical Properties


Dielectric Constant
1 MHz
8.6
Loss Tangent
1 MHz
5x10^-4
Dielectric Strength
kV/mm
>15
Volume Resistivity


25°C
Ω cm
>10^13
300°C
Ω cm
10^9
500°C
Ω cm
10^7



  • Note – Aluminum Nitride Ceramics is susceptible to surface oxidization. When this happens, a layer of Aluminum Oxide forms. This does help to protect the material, however, it impacts the thermal conductivity (Alumina is ~30 W/m.K). In oxidizing atmospheres, this happens around 700°C. In inert atmospheres this layer protects the AlN up to ~1350°C. Bulk oxidation will occur at temperatures above this.


Aluminum Nitride Ceramics for Thermal Management of Electronic Devices

Aluminum Nitride Ceramics is one of the few materials that offers electrical insulation and high thermal conductivity. This makes AlN extremely useful in high power electronic applications in heat sink and heat spreader applications. 

Rapid Prototyping of Aluminum Nitride Ceramic Components

XMCERA is your Aluminum Nitride Ceramic precision machining specialist for your advanced technical ceramic components prototyping & manufacturing needs.

XMCERA are always happy to use our many years of advanced ceramics experience to provide solutions of materials, design, and application.

We can produce aluminum nitirde ceramic for any shapes(Plate, bar, pipe, crucible, complex design)!

Brief Introduction Applications of Aluminum Nitride Ceramics


Holen Sie sich den neuesten Preis? Wir werden so schnell wie möglich antworten (innerhalb von 12 Stunden)

Datenschutz-Bestimmungen